temperature control for semiconductor production
Process Cooling and Heating System
Cooperate With Lithography machines, Etching machines, Ion Implantation machines, Cleaning machines, Vapor deposition equipment, etc
Liquid &Gas temperature control technology, mainly used for temperature testing simulation in semiconductor testing, with wide temperature orientation and high temperature rise and fall, temperature range -85 ℃~250 ℃, suitable for various testing requirements. LNEYA actively explores and researches component testing systems, committed to solving the problem of temperature control lag in electronic components. Cooling technology can be directly cooled from 300 ℃. This product is suitable for precise temperature control needs of electronic components.
In the manufacturing of semiconductor electronic components used in harsh environments, the testing phase of IC packaging assembly, engineering, and production includes electronic cold and hot testing at temperatures (-85 ℃ to+250 ℃) and other environmental testing simulations.
Wafer manufacturing process flow
Photolithography process
Lithography machine
Cleaning machine
Measurement equipment
Diffusion process
Oxidation furnace
Measurement equipment
Temperature control equipment
Process exhaust gas treatment
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etching process
Etching equipment
Cleaning machine
Measurement equipment
Temperature control equipment
Waste gas treatment equipment
Thin film deposition
Vapor deposition equipment
Cleaning machine
Annealing equipment
Measurement equipment
Temperature control equipment
Waste gas treatment equipment
vacuum pump
The process flows back and forth!
ion implantation
Ion implantation machine
Glue remover
Cleaning machine
Temperature control equipment
vacuum pump
The above 5 processes are the front-end processes for semiconductor manufacturing, among which etching, ion implantation, thin film deposition, and diffusion require temperature control systems in 4 processes, and VOC treatment in 3 processes.
The subsequent packaging and testing process also requires a temperature control system.
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CoolingChillers
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ETCU+5 ℃~90 ℃ heat exchange system without compressor
ETCU 5℃~+90℃ Request A Quote Configuration Details Model ETCU-005W ETCU-008W ETCU-015W ETCU-030W Temp control Cooling water +5℃~90℃ ±0.3℃ Cooling water temp. 7℃~30℃ Use Siem…
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FLT -100℃~+80℃ Reverse ltricat Cooling
FLT -100℃~+80℃ Request A Quote Configuration Details Model FLT-803W FLT-805W FLT-806W FLT-808W FLT-810W Temp Range -80℃~+80℃ Temperature Control Accuracy ±0.1℃ Flow Co…
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FLTZ -30℃~40℃ Double Frequency Conversion
FLTZ -30℃~40℃ Request A Quote Configuration Details Model FLTZ-305W FLTZ-305W/2T Double System Temp Range -30℃~40℃ -30℃~40℃ -30℃~…
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FLT -45℃~40℃
FLT -45℃~40℃ Request A Quote Configuration Details Model FLT-402 FLT-402W FLT-403 FLT-403W FLT-404 FLT-404W FLT-406 FLT-406W FLT-408 FLT-408W FLT-410 FLT-410W FLT-415 FLT-415W T…
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FLT -25℃~40℃
FLT 5℃~40℃ Request A Quote Configuration Details Model FLT-202 FLT-202W FLT-203 FLT-203W FLT-204 FLT-204W FLT-206 FLT-206W FLT-208 FLT-208W FLT-210 FLT-210W FLT-215 FLT-215W Tem…
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FLT 5℃~40℃
FLT 5℃~40℃ Request A Quote Configuration Details Model FLT-002 FLT-002W FLT-003 FLT-003W FLT-004 FLT-004W FLT-006 FLT-006W FLT-008 FLT-008W FLT-010 FLT-010W FLT-015 FLT-015W Tem…
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Gas CoolingChillers
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AES -120℃~+300℃
AES -120℃~+300℃ Temperature Forcing System · Temperature Control Accuracy ±1℃ · Temperature Conversion 10s~20s · Power 3.7kW~7.5kW · Refrigent R404A/R23/R14/R508B · Type Air-cooling/Water-cooling …
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MD -75℃~225℃
MD -75℃~225℃ INQUIRY Configuration Details Model MD-708 MD-712 MDL-708 Temp. Range -75℃~225℃ -75℃~225℃ -75℃~225℃ Temperature control accuracy ±0.1℃ ±0.1℃ ±0.1℃ temperature uni…
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Direct Cooling&VOCs
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ZLJ-2.5P&4P
ZLJ-2.5P&4P INQUIRY Configuration Details Model ZLJ-2.5P-S ZLJ-4P-S Cooling Capacity 5kw~6kw 10kw Refrigerant R134a R134a Suction pressure (control according to actual battery pack matching) 300k…
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YQH -75℃~-40℃
YQH -75℃~-40℃ Used in gas condensation and liquefaction recovery. VOCS gas or other electronic gases are connected to the equipment through an induced draft fan, and are liquefied, captured and separated into a collection tank by…
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Process usage in semiconductor manufacturing
Etching Process
Cooperate with AOI system
Tungsten Contact Etch | |
Via Etch | Component defect IC polarity identification |
Metal Etch | Component defect IC pins |
Aluminum pad Etch | Component defect IC pin float |
Passivation Etch | Component defects with/missing parts |
STI Etch | Polarity labeling of component defects |
Gate Etch | Component defects stand out |
Spacer Etch | Component defect displacement/skew |
Silicon groove etching (SiGe Etch) | Component defect displacement/Huo Xie |
Stress Memory Etch | Component defect pin not inserted |
Stress Adjacent Technology Etch (SPT Etch) | Insufficient rolling of solder joint defects |
Double stress layer etching (DSL) | Solder joint defects with excessive tin |
Provide cooling and cooling for the air compressor
- During wafer fabrication, the air compressor can meet the requirements of the production process by controlling the temperature and humidity of the air.
- During the wafer cleaning process, the air compressor is mainly used to provide high-pressure gas to flush pollutants off the wafer surface.
- In the process of chip manufacturing, air compressors are mainly used to provide sufficient mechanical energy to ensure the quality of chip cutting and engraving.
- During the packaging testing process, the air compressor is mainly used to provide high-pressure gas to ensure the packaging quality of the chip.
Which process do you need to use a temperature control system in?
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