MD’s greatest innovation in thermal testing is the series of thermally controlled chucks, which are mainly used for performance testing, modeling, process development, design defect or IC failure analysis of semiconductor wafers. It can realize rapid temperature change and precisely control the temperature. The system itself has its own refrigerator, which avoids the consumption of liquid nitrogen, carbon dioxide, etc., and each system includes a chuck and a cold and hot control unit.

The inside of the plate adopts the direct evaporation method of refrigerant, which greatly improves the heat exchange efficiency and the heat exchange power per unit area of the plate compared with the liquid cooling method.

Features:
Rapid cooling/heating rates up to 25°C/min
Built-in refrigerator to avoid the consumption of liquid nitrogen, carbon dioxide, etc. Programmable automation, temperature stability +/-0.1
Controller provides touch screen and remote interface to precisely control and monitor equipment temperature
Display test status – real-time data

Thermal Chuck MD series provides an open flat surface working platform, rapid temperature rise and fall, and constant temperature control, which can be used for testing RF devices and high-density power devices (IGBTSAND MOSFETS), and can also be used for rapid cooling of laboratory flat panels (plasma, biological products, batteries), etc.